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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MDC3237T1/D Integrated Dual Inductive Load Driver Application circuit designs are moving toward the consolidation of device count and into smaller packages. The new SOT-363 package is a solution which simplifies circuit design, reduces device count, and reduces board space by integrating a few discrete devices into one small six-leaded package. The SOT-363 is ideal for low-power surface mount applications where board space is at a premium, such as portable products. This device is intended to replace an array of four to eight discrete components in an integrated SOT-363 package. * Optimized to Switch Inductive Pager/Phone Loads Such as Motors, Lamps and Speakers from a 0.9 to 1.7 V Rail * LowVCE(sat) Performance * Internal Output Clamp Diodes * Provide a Robust Driver Interface between Inductive Load and Sensitive Logic Circuits Applications include: * Pager Silent Alert Motor * Pager E/M Acoustic Transducers Ordering Information: * MDC3237T1: 8 mm, 7-inch/3,000 Unit Tape and Reel * MDC3237T3: 8 mm, 13-inch/10,000 Unit Tape and Reel MDC3237T1 6 5 4 1 2 3 CASE 419B-01 SC-70/SOT-363 INTERNAL CIRCUIT DIAGRAM VCC (2) Vout (6) Vin (1) GND (5) Vout (3) Vin (4) INTERNAL CIRCUIT DIAGRAM 6 5 4 1 2 3 MAXIMUM RATINGS Rating Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector-Current Continuous Diode Reverse Voltage Symbol VCEO VCBO VEBO IC VR Value 15 15 5.0 200 8.0 Unit Vdc Vdc Vdc mAdc Vdc THERMAL CHARACTERISTICS Characteristic Total Device Dissipation Thermal Resistance Junction to Ambient Junction and Storage Temperature Symbol PD RqJA TJ, Tstg Max 150 833 -55 to 150 Unit mW C/W C DEVICE MARKING MDC3237T1 = E7 (c) Motorola, Small-Signal Transistors, FETs and Diodes Device Data Motorola Inc. 1998 REV 1 1 MDC3237T1 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Collector - Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0 mAdc) Collector - Base Breakdown Voltage (IC = 10 mAdc, IE = 0 mAdc) Emitter - Base Breakdown Voltage (IC = 10 mAdc, IC = 0 mAdc) V(BR)CEO 15 V(BR)CBO 15 V(BR)EBO 5.0 -- -- -- -- Vdc -- -- Vdc Vdc ON CHARACTERISTICS DC Current Gain (IC = 100 mAdc, VBE = 5.0 Vdc) Collector - Emitter Saturation Voltage (IC = 100 mAdc, IB = 5.0 mAdc) Base - Emitter Saturation Voltage (IC = 100 mAdc, IB = 2.0 mAdc) hFE 100 VCE(sat) -- VBE(sat) -- -- 0.900 -- 0.150 Vdc -- 400 Vdc -- SMALL- SIGNAL CHARACTERISTICS Current - Gain -- Bandwidth Product (IC = 50 mAdc, VCE = 5.0 Vdc, f = 20 MHz) Output Capacitance (VCB = 10 Vdc, f = 1.0 MHz) Input Capacitance (VEB = 0.5 Vdc, f = 1.0 MHz) fT 100 Cobo -- Cibo -- -- 105 -- 18 pF -- -- pF MHz DIODE CHARACTERISTICS Reverse Breakdown Voltage (I(BR) = 100 Adc) Forward Voltage (IF = 50 mAdc) Reverse Recovery Time (IF = IR = 10 mAdc) V(BR) 8.0 VF -- trr -- -- 25 -- 1.0 ns -- -- Vdc Vdc 3 Vdc 0.9 TO 1.7 Vdc SPEAKER Vout (6) Vin VCC MDC3237T1 (2) VIBRATOR Vout (3) Vin (4) CMOS MCU (1) GND (5) Figure 1. Multiple Loads With Dual Inductive Load Driver 2 Motorola Small-Signal Transistors, FETs and Diodes Device Data MDC3237T1 INFORMATION FOR USING THE SOT-363 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. SOT-363 0.5 mm (min) 1.9 mm SOT-363 POWER DISSIPATION The power dissipation of the SOT-363 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOT-363 package, PD can be calculated as follows: PD = TJ(max) - TA RJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 120 milliwatts. PD = 120C - 25C 833C/W = 120 milliwatts The 833C/W for the SOT-363 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 120 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT-363 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperature and time shall not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. Motorola Small-Signal Transistors, FETs and Diodes Device Data EEE EEE EEE EEE EEE EEE EEE EEE EEE EEE EEE EEE EEE EEE 0.4 mm (min) SOLDERING PRECAUTIONS 0.65 mm 0.65 mm 3 MDC3237T1 PACKAGE DIMENSIONS A G V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 6 5 4 S 1 2 3 -B- D 6 PL 0.2 (0.008) M B M N J C DIM A B C D G H J K N S V INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 0.30 0.40 H K CASE 419B-01 ISSUE C Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 Customer Focus Center: 1-800-521-6274 MfaxTM: RMFAX0@email.sps.mot.com - TOUCHTONE 1-602-244-6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, Motorola Fax Back System - US & Canada ONLY 1-800-774-1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 - http://sps.motorola.com/mfax/ HOME PAGE: http://motorola.com/sps/ JAPAN: Nippon Motorola Ltd.; SPD, Strategic Planning Office, 141, 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan. 81-3-5487-8488 4 MDC3237T1/D Motorola Small-Signal Transistors, FETs and Diodes Device Data |
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